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Vysokoškolské práce
Bakalářské a diplomové práce
Fakulta mechatroniky, informatiky a mezioborových studií
Simulation of Thermomechanical Stress on Potted Electronic Assemblies
Simulation of Thermomechanical Stress on Potted Electronic Assemblies
Title Alternative:
Simulation of Thermomechanical Stress on Potted Electronic Assemblies
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APPENDIX_D_Visualization_of_Results.pdf
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Žáček, Václav
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https://dspace.tul.cz/handle/15240/49431
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Fakulta mechatroniky, informatiky a mezioborových studií
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