Analýza vlivu geometrie spojů na výslednou impedanci
Title Alternative:Analysis of the influence of tracks geometry on the resulting impedance
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Date
2011
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Publisher
Technická Univerzita v Liberci
Abstract
Tato diplomová práce se zabývá zkoumáním impedance vodičů vyrobených za pomoci řízené impedance. Zkoumané vodiče byly obsaženy v testovacích kupónech. Impedance vodičů na všech dodaných kupónech byla ověřena za pomoci měřící ústředny (kapitola 6.1.). Na základě měření byly vybrány dvě desky od každého motivu. U každé vybrané desky se provedly metalografické výbrusy na třech různých místech. U takto vzniklých vzorků se prozkoumaly rozměry vodiče a vzdálenosti vodiče od referencí pomocí mikroskopu (kapitola 6.3). Na základě tohoto zkoumání byly odhaleny chyby, u který se následně stanovily důvody vzniku.
This thesis deals with the impedance of the Printed Circuit Boards (PCB) wires produced using controlled impedance. The examined wires are manufactured in the test coupons, which is a part of the produced circuit boards. Impedance of all wires were tested using the system for controlled impedance measurements (described in chapter 6.1.). Two boards of each PCB design were selected, this selection was based on results of the measurements. For each selected PCBs metallographic cuts were prepared in three different locations. The selected samples were examined the dimensions of wires and theirs distances from references were measured by using a metalographic microscope (see Chapter 6.3). Based on this study the errors were detected; in the last chapter the solutions were proposed to eliminate the next error occurance.
This thesis deals with the impedance of the Printed Circuit Boards (PCB) wires produced using controlled impedance. The examined wires are manufactured in the test coupons, which is a part of the produced circuit boards. Impedance of all wires were tested using the system for controlled impedance measurements (described in chapter 6.1.). Two boards of each PCB design were selected, this selection was based on results of the measurements. For each selected PCBs metallographic cuts were prepared in three different locations. The selected samples were examined the dimensions of wires and theirs distances from references were measured by using a metalographic microscope (see Chapter 6.3). Based on this study the errors were detected; in the last chapter the solutions were proposed to eliminate the next error occurance.
Description
katedra: ITE; přílohy: 1 DVD ROM; rozsah: 63
Subject(s)
řízená impedance, testovací kupón, vlastnosti plošných spojů, impedance control, test coupons, pcb properties