Composite for thermal protection, in particular for cooling electronic components
dc.contributor.author | Wiener Jakub | cs |
dc.contributor.author | Militký Jiří | cs |
dc.contributor.author | Marek Jaromír | cs |
dc.date.accessioned | 2022-01-29T18:19:59Z | |
dc.date.available | 22-29-2021 | en |
dc.date.available | 2022-01-29T18:19:59Z | |
dc.date.issued | 2020 | cs |
dc.identifier.uri | https://dspace.tul.cz/handle/15240/162025 | |
dc.language.iso | cze | cs |
dc.relation.uri | https://isdv.upv.cz/doc/FullFiles/Patents/FullDocuments/308/308571.pdf | cs |
dc.riv.kontrolni-cislo | 192273577 | cs |
dc.riv.kontrolni-cislo | 192273903 | cs |
dc.riv.specifikace | RIV/46747885:24410/20:00008722!RIV21-MSM-24410___ | cs |
dc.riv.specifikace | RIV/46747885:24620/20:00008722!RIV21-MSM-24620___ | cs |
dc.subject | composite | cs |
dc.subject | thermal protection | cs |
dc.title | Composite for thermal protection, in particular for cooling electronic components | en |
dc.title | Kompozit pro teplotní ochranu, zejména pro chlazení elektronických součástek | cs |
local.identifier.publikace | 8722 |